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CIOhu 2013 címmel adtam elő a CIO. HU 2013 konferencián, a hazai vállalatok informatikai gyakorlatának alakulásáról 2009-2013 között. Kiegészítésként megemlíthető, hogy szinte az össze fejlesztési terület esetében visszaesés volt tapasztalható az elmúlt évekbe.
InvenQ Insight Innovacios Kozhasznu Nonprofit Kft.
Peter Feher
Kapolna ut 21/b
Budapest, 1112
HU
3D DRAM DRIVING NEXT GEN DATA CENTER PERFORMANCE AND EFFICIENCY. BONDING AND INTERCONNECT FOR SENSORS. 3D INTERCONNECT FOR PACKAGE-ON-PACKAGE AND SYSTEM-IN-PACKAGE VOLUME PRODUCTION. We develop and license innovative chip-scale packaging and interconnect technologies. Finest Pitch, Thinnest, Smallest Footprint and. We develop and license innovative chip-scale packaging and interconnect technologies. San Jose, CA 95134.
Which Application is right for you? Which Solution is right for you? Which Technology is right for you? Support Center and FAQ. Humans intuitively understand audio capture to be a critical factor in awareness of their surroundings. TDK is working to enable the same level of awareness for smart devices with leading-edge MEMS microphones. TDK combines the capability to sense audio along with cutting-edge motion detection, which is .
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